Flexible FE/BE Sensor Pilot Line for the Internet of Everything

IoSense’s overall project goal is to boost the European competitiveness of the electronics components and systems industries by increasing the pilot production capacity and improving time-to-market for innovative microelectronics, accomplished by establishing fully connected pilot lines in ‘More than Moore’ technologies, supporting discrete and integrated sensor solutions including ASICs (Application Specific Integrated Circuit), test beds, device packaging and assembly to accelerate the uptake of KETs (Key Enabling Technologies). The new pilot lines will form a network with existing specialized R&D and manufacturing lines to work as a European modular solution system. In particular the segment of sensor technologies and MEMS (Micro Electro Mechanical Systems), which plays a key role in solving the grand societal challenges, related to Smart Mobility, Society, Energy, Health and Production will be addressed. (IoSense homepage, 2016)


IoSense spans expertise and partners along the whole value chain involving main actors in the respective domains. All partners complement each other in a well-balanced and structured way avoiding overlaps and covering all then expertise needed. Large companies, SMEs and research institutes have all capabilities and necessary infrastructure for research, manufacturing as well as bringing the results to market. The IoSense consortium connects 33 partners from 6 countries in Europe, cf. Figure 1. (IoSense homepage, 2016)

Fig. 1: IoSense consortium with 33 partners from 6 european countries (Infineon Dresden, 2016)

Within the IoSense project the University of Applied Sciences Burgenland demonstrates the improvement of heating, ventilation and air conditioning capabilities by integrated sensor solutions and smart gas sensor networks. This offers new approaches for sustainable energy generation, reduction of energy consumption and efficient energy management in future buildings of urban environments across Europe.

Duration: 05/2017 - 04/2019


Infineon Dresden (2016): IoSense - Flexible FE/BE Sensor Pilot Line for the Internet of Everything, project poster, European Nanoelectronics Forum 2016, 23 & 24 November, Rome, Italy

Funding agencies, research & cooperation partners

This project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking under grant agreement No 692480. This Joint Undertaking receives support from the European Union’s Horizon 2020 research and innovation programme and Germany, Austria, Belgium, Netherlands, Slovakia, Spain.

Funding agency

IoSense is funded by the Austrian Federal Ministry of Transport, Innovation and Technology (BMVIT) under the program "ICT of the Future" between 05/2017 and 04/2019. More information

Further Informations - Links

Project team and project manager

Project manager

  • Christian Heschl
    Prof.(FH) DI(FH) Dr. Christian Heschl
    Dept. Energy & Environment
    Campus Pinkafeld

    Schwerpunkte in Forschung und Lehre:
    Gebäudetechnik, Sorptionstechnik, Thermodynamik, Wärme- und Stofftransport, Computational Fluid Dynamics (CFD)

Project team

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